IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, VOL. 7, NO. 3, SEPTEMBER 2019 1777
Thermal Optimization of Modular Multilevel
Converters With Surplus Submodule Active-Bypass
Plus Neutral-Point-Shift Scheme Under
Unbalanced Grid Conditions
Wuhua Li , Member, IEEE, Heya Yang , Jing Sheng, Chushan Li, Min Chen ,
Xiangning He , Fellow, IEEE , and Xiaowei Gu
Abstract— The thermal design of highly reliable modular
multilevel converters (MMCs) is significant for the voltage-source
converter based high-voltage direct current (VSC-HVdc) systems,
especially under the ac unbalanced fault. In this paper, the
surplus submodule is employed as new control freedom to
optimize the thermal behavior of the MMCs, because its number
is linearly increased with the ac voltage dip. With the surplus
submodule active bypassed (SSAB), the total submodules of the
MMC in one arm can be taken turns to reduce the thermal stress
of the hottest power device. In order to obtain equal ac voltages in
three phases to improve the SSAB strategy, the neutral-point-shift
(NPS) scheme is introduced under the unbalanced conditions,
especially single-phase-to-ground fault. Through the balancing of
the amplitude of the MMC ac voltages with the NPS scheme, the
thermal stress asymmetry of theMMC under the single-phase-
to-ground fault is mitigated, and the junction temperature of
the most stressed power devices is significantly reduced. Finally,
the simulation and experiment results show that the junction
temperature rise of the most stressed power device is reduced by
nearly 30% with the SSAB plus NPS scheme.
Index Terms—Modular multilevel converters (MMCs), ther-
mal stress optimization, unbalanced operation.
NOMENCLATURE
i
jp
/u
jp
MMC upper arm currents/voltage.
i
oj
/u
oj
MMC ac current/voltage.
i
dc j
/ U
dc
MMC dc current/voltage.
I
o1
/U
o j
Amplitude of i
oj
/u
oj
.
Manuscript received December 25, 2018; revised April 11, 2019; accepted
May 18, 2019. Date of publication June 10, 2019; date of current version
July 31, 2019. This work was supported in part by the National Key Research
and Development Program of China under Grant 2018YFB0904600, in part by
the National Nature Science Foundation of China under Grant U1834205 and
Grant 51677166, and in part by the Zhejiang Provincial Key Research and
Development Program under Grant 2018C01SA150059. Recommended for
publication by Associate Editor Joseph O. Ojo. (Corresponding author:
Min Chen.)
W. Li, H. Yang, J. Sheng, M. Chen, and X. He are with the College
of Electrical Engineering, Zhejiang University, Hangzhou 310027, China
(e-mail: woohualee@zju.edu.cn; yangheya@zju.edu.cn; zjdxsj2013@zju.
edu.cn; calim@zju.edu.cn; hxn@zju.edu.cn).
C. Li is with the College of Electrical Engineering, Zhejiang University,
Hangzhou 310027, China, and also with Zhejiang University–University of
Illinois at Urbana–Champaign Institute, Zhejiang University, Haining 314400,
China (e-mail: chushan@intl.zju.edu.cn).
X. Gu is with the School of Information Science and Technology, Zhejiang
Sci-Tech University, Hangzhou 310018, China (e-mail: gxw@zstu.edu.cn).
Color versions of one or more of the figures in this paper are available
online at http://ieeexplore.ieee.org.
Digital Object Identifier 10.1109/JESTPE.2019.2921795
u
v j
/u
Lj
AC voltages on Bus1/ac inductance.
U
+
v 1
/U
-
v 1
Positive-/negative-sequence
amplitude of u
v j
.
ϕ
+
v j
/ϕ
-
v j
Positive-/negative-sequence phase
angles of u
v j
.
U
v 1
Rated amplitude of u
v j
.
D
p
Voltage dip severity.
N
rated
/ N
min j
Rated/minimum number of active
submodules.
R
total
/ R
new
Total/newly increased number of sur-
plus submodules.
k
bypass
Ratio of bypass time to total opera-
tion time of submodule.
T
j x
Junction temperature of switch x (x
is T
1
– D
2
).
T
j max
Maximum junction temperature in
submodule.
u
NO
Injected zero-sequence voltage.
α Phase angle of u
NO.
( j = a , b, c)
I. I NTRODUCTION
D
RIVEN by the growing demands on offshore wind farm
integration and asynchronous power grid interconnec-
tion, the installation of voltage-source converter-based high-
voltage direct-current (VSC-HVdc) transmission has been
continuously increasing in recent years [1]–[3]. Compared
with the line-commutated-converter based high-voltage direct-
current (LCC-HVdc) transmission, VSC-HVdc has the merits
of independent active/reactive power regulation, black start-
up capability, and small footprints [4], [5]. The modular
multilevel converters (MMCs), featuring small harmonic com-
ponents, high conversion efficiency, and low manufacture
demand, are considered as the breakthrough technology for
VSC-HVdc [6]–[9]. As the power rating of VSC-HVdc system
keeps increasing, the MMCs should be not only able to with-
stand the severe grid disturbances but also provide sufficient
power support during the grid fault [10]–[12]. Accordingly,
the design of highly reliable MMCs is significant.
Power semiconductor devices are the major fragile com-
ponents in the power conversion systems, and the thermal
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