                                     ! ""  #$"$%   "&$ ’(% )#* + ,-. &!/+0 1"$ +2 3 4, 0&56.7 & 89: )0;<* <; / 1 / 10 /  / 0 )$ 0( "$=" ("=* <;  0& 576 &&&1 )0;<* $"">" $>=$=( =>=$=( >=$=( ?$>=$=( =$>  " ( $ )0!* @ " " @ ( @ #!/1#   % $("  Processing of WCu graded materials from attritormilled WCuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by cocompaction of a 10/20/30wt%Cu multilayer material is briefly discussed. Liquid Cu migration is observed and smoothes the composition gradient. Perspectives to control this migration are discussed.  WCu functionally graded materials offer the opportunity to combine a refractory Wrich phase having a low thermal expansion coefficient and a high strength with a Curich phase having a high thermal and electrical conductivity. A possible application is first wall assembly samples for the future nuclear fusion experiment ITER [1]. Smooth transition from Wrich phase to Curich phase would limit the thermomechanical stresses between W facing plasma and the Curich heat sink. In case of electrical contacts a graded structure between the contact area and the bulk materials could also be beneficial. Graded WCu structures can also be used as heat sinks for packaging microelectronic devices, the composition in the Wrich part being adjusted to match the thermal expansion coefficient of the semiconductor or ceramic material [2]. However, WCu powder mixtures usually exhibit a poor sinterability, due to the weak chemical interaction between W and Cu. Relatively high sintered densities could nevertheless be obtained starting from WCuO powder mixtures, although the effect of the CuO reduction on sintering is still not clear [3].  WCuO powder mixtures with compositions corresponding to 10, 20 and 30wt% Cu in the reduced mixture were prepared. CuO Aldrich 241741 powder consists of particles with a broad particle size distribution (0.7100 ;m) and irregular shape whereas W Eurotunsgtene AW1106 powder has a rather narrow primary particle size distribution (0.30.5 ;m), with agglomerates up to 100 ;m. A first set of mixtures was processed through attritor milling for 3h in acetone media with tungsten carbide balls. Dried powders were uniaxially compacted into cylindrical samples (=8 mm ; =68 mm) under 400 MPa. The powder reduction steps were characterized by thermogravimetric analyses (TGA), dilatometry, XRD, SEM and TEM microstructural analyses. A second set of mixtures was processed to improve the sintering ability. The milling conditions were first optimized and powders were reduced at 350°C for 2h and granulated with 1wt% polyethylene glycol (PEG) before uniaxial compaction. Green compacts were sintered at temperatures up to 1300°C under He/H 2 reducing atmosphere (4vol% H 2 ). Graded samples were processed by cocompacting and co sintering stack of powder layers with different compositions. Materials Science Forum Vols. 534-536 (2007) pp 1569-1572 Online available since 2007/Jan/15 at www.scientific.net © (2007) Trans Tech Publications, Switzerland doi:10.4028/www.scientific.net/MSF.534-536.1569 All rights reserved. No part of contents of this paper may be reproduced or transmitted in any form or by any means without the written permission of TTP, www.ttp.net. (ID: 129.128.216.34, University of Alberta, Edmonton, Canada-08/10/14,15:32:26)