Annealing influences on phosphorus-ion-implanted vicinal Si(111) studied by reflective
second-harmonic generation
Kuang Yao Lo* and Yi Jen Huang
Department of Applied Physics, National Chia Yi University, Chia Yi, Taiwan 600, Republic of China
and Institute of Optoelectronics and Solid State Electronics, National Chia Yi University, Chia Yi, Taiwan 600, Republic of China
Received 21 August 2006; published 3 July 2007
Annealing effects on the implanted vicinal Si111 were analyzed by reflective second-harmonic generation
RSHG. The phenomena of impurity diffusion and precipitation were observed through the anisotropic con-
tribution of the C
3V
component in the RSHG rotational anisotropy experiments for a series of rapid thermal
annealing RTA times. The surface reconstruction of the implanted vicinal Si111 was clearly observed due to
the contribution of the C
1V
symmetry which is raised from the step structure on the vicinal surface. The
enhanced value of the C
1V
component originates because P atoms participate in the surface reconstruction. The
phase difference between the C
3V
and C
1V
components has large variations at lower RTA temperature because
the reconstruction situation near the surface was not completed until the RTA time of 30 s and was influenced
by the precipitation of P atoms. With the assistance of step structure on vicinal Si111, the reconstruction of
the implanted Si111 reveals more physical information.
DOI: 10.1103/PhysRevB.76.035302 PACS numbers: 78.20.-e, 42.65.-k, 61.72.Tt
I. INTRODUCTION
Optically reflected second-harmonic generation RSHG
has proven to be a sensitive tool for obtaining information on
the structural and electronic properties of metal and semicon-
ductor surfaces.
1,2
The symmetrical group of the silicon sur-
face differs from that of the silicon bulk, which is a cen-
trosymmetrical media.
3
RSHG is forbidden within the
electric-dipole approximation in centrosymmetrical media
and only allowed on the surface and interfaces, where the
bulk symmetry is broken. Therefore, the RSHG signal is
very strongly influenced by the surface layer of these mate-
rials, where the reduced symmetry enables the SHG process.
Anisotropic contributions to RSHG intensity have been used
for studies of the phenomenological theory and analysis from
Si.
1,4
SHG rotational anisotropy RA-SHG is indeed highly
sensitive to the microscopic structure and symmetrical prop-
erties of the silicon interface structure.
5
To obtain the higher performance of very large scale in-
tegration, it is necessary to deeply understand the mechanism
of thin film growth. One of the chief issues the silicon device
industry faces for miniaturization is the production of ul-
trashallow doped layers,
6
since the formation of ultrashallow
layers is important for the fabrication of nanosemiconductor
devices. In particular, variations in the interface of the ul-
trashallow layer during the thermal process will influence the
device performance.
7
A high degree of reproducibility and
control of dopant purity, dosage, and spatial distribution for
the requirement in the ultrashallow doped layers can be
achieved by low-energy ion implantation techniques and
rapid thermal annealing RTA processes. RTA technology is
an efficient technique to remove the ion implantation dam-
age, activate dopant impurities, and produce a surface with
crystal quality and sheet resistance equal to or greater than
those obtained by conventional furnace annealing, but with
the advantage of reduced impurity redistribution.
8
The results of the low-energy implanted silicon dealt with
the RTA process have been successfully diagnosed by the
RA-SHG method,
9
and theoretical analyses have been pre-
sented to explain the actual phenomena in the RTA process.
10
This nondestructive method presented an illustration of the
recrystallization degree in the shallow region that was not
explained by traditional x-ray diffraction. Our previous re-
sults showed that the RTA temperature is a key factor in
recrystallizing the dosed range and diffusing the impurities
within the expected range. After a suitable RTA process, the
destroyed region of Si is recrystallized and implanted impu-
rities enter the Si sites in the pattern of a well-ordered sub-
lattice with polar bond behavior. Govorkov et al.
11
pointed
out that the inhomogeneous strain-induced contribution to
the second-order nonlinear susceptibility tensor would have
the same nonvanishing components as the surface-dipole
nonlinear susceptibility tensor. The residual electrical dipoles
are formed along the surface symmetry during the RTA pro-
cess, since implanted impurities enter the Si sites with
enough activation energy. These are additional SHG sources
from the implanted silicon.
10
Accordingly, Lo presented the
potential of identifying the recrystallized condition during
the RTA treatment by analyzing RSHG patterns.
10
However,
the analysis results of the RSHG method are integrated over
the surface region, which is limited by the penetration depth
of the incident light. Thus, further formations on the top
surface layers of implanted silicon would be hidden in the
bulklike surface region layer.
Recently, vicinal Si111, which is cut with a small offset
angle towards the 112
¯
direction, was used in the SHG stud-
ies for the surface adsorption and buried interface since vici-
nal Si111 surface reflects a onefold symmetry originating
from the surface steps in the 112
¯
direction.
11–13
Except for
the contribution of threefold symmetry C
3V
from the 111
terraces, the appearance of steps on the vicinal Si111 sur-
face gives a strong effect in observing RA-SHG and this
result is consistent with the regular step structure having C
1V
symmetry. RA-SHG studies of Si-O bondings on vicinal
Si111 and H-atom termination have suggested that the one-
fold contribution to the SHG signal comes primarily from Si
atoms at or in the immediate vicinity of the surface
steps.
12–14
These studies revealed that the step structures on a
PHYSICAL REVIEW B 76, 035302 2007
1098-0121/2007/763/0353027 ©2007 The American Physical Society 035302-1