Gifty K Baby et. al. /International Journal of Modern Sciences and Engineering Technology (IJMSET) ISSN 2349-3755; Available at https://www.ijmset.com Volume 1, Issue 7, 2014, pp.80-87 © IJMSET-Advanced Scientific Research Forum (ASRF), All Rights Reserved “IJMSET promotes research nature, Research nature enriches the world’s future” Review on thermal challenges in embedded system GIFTY K BABY 1 Electronics and Communication Department, Toc H Institute of Science and Technology, Kerala, India. Email:giftykalapurackal@gmail.com GNANA SHEELA K 2 Electronics and Communication Department, Toc H Institute of Science and Technology, Kerala, India. Email:sheelabijins@gmail.com Abstract Embedded systems are used in safety critical areas such as automotive electronics and medical applications. These safety critical applications impose strict requirements on reliability, performance, low power and testability of the underlying VLSI circuits. The VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability with silicon technology scaling. Several thermal impacts on VLSI circuits and their related challenges are discussed. This paper presents also a few emerging techniques that take temperature into account in the design and test processes. There are number of embedded computers controlling virtually all devices and systems in a huge spectrum of application areas including aerospace, manufacturing, chemical processes, healthcare care, automotive, transportation, telecommunication, and consumer appliances. Many of these systems are safety-critical, such as automotive electronics and medical equipment, with stringent reliability and real time requirements. At the same time, with silicon technology scaling, VLSI circuits used to implement the computational components of these systems are built with smaller transistors, operate at higher clock frequency, run at lower voltage levels, and operate very often at higher temperature. Consequently, they are subject to more faults and interferences. Keywords-Dynamic Thermal Management; Burn-in; Principal Orthogonal Decomposition; Model-Based Design 1.INTRODUCTION Recently embedded system encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature related issues have become especially important within the past several years. This paper summarizes recent thermal management techniques for embedded system. Temperature monitoring, requirement for Dynamic Thermal Management (DTM), includes temperature estimation and sensor placement techniques for accurate temperature measurement or estimation. Micro architectural techniques include both static and dynamic thermal management techniques that control hardware structures. Floor planning covers a range of thermal-aware floor planning techniques for 2D and 3D microprocessors. OS/ compiler techniques include thermal-aware task scheduling and instruction scheduling techniques. Liquid cooling techniques are higher capacity alternatives to conventional air cooling techniques. Thermal reliability/security issues cover temperature-dependent reliability modeling, Dynamic Reliability Management (DRM), and malicious codes that specifically cause overheating. Temperature-related issues will only become more challenging as process technology continues to evolve and transistor densities scale up faster than power per transistor scales down. International Journal of Scientific & Engineering Research, Volume 5, Issue 11, November-2014 ISSN 2229-5518 1434 IJSER © 2014 http://www.ijser.org IJSER