Surface Science 433–435 (1999) 512–516
www.elsevier.nl/locate/susc
Cu induced step bunching on a Si(111) vicinal surface
studied by reflection electron microscopy
Y. Takahashi, H. Minoda *, Y. Tanishiro, K. Yagi
Department of Physics, Tokyo Institute of Technology, Oh-okayama, Meguro, Tokyo 152-8551, Japan
Abstract
Step bunching induced by Cu adsorption on a Si(111) vicinal surface was studied by reflection electron microscopy.
A surface with a regular array of steps changes to wide (111) terraces and step bands due to the formation of the
incommensurate (IC ) Cu-adsorbed structure on the Si(111) terraces. The maximum terrace width of the IC domains
depends on the deposition conditions of Cu, and is wider at higher temperature and at lower deposition rate. (441)
and (331) facets are formed on a vicinal Si(111) surface inclined towards the 112 direction, while no facet with
definite index is noticed on a vicinal surface inclined towards the 110 direction. © 1999 Elsevier Science B.V. All
rights reserved.
Keywords: Cu; Si(111); Surface reconstruction; Surface steps
1. Introduction enable us to make a well-defined nanostructure
without a lithographic technique.
Metal adsorption induced step bunching and Metal adsorption induced step bunching and/or
faceting on a vicinal Si surface is an attractive faceting in several systems has been studied by
reflection electron microscopy (REM ) and spot phenomenon from both the fundamental and
industrial points of view. Metal adsorption on a profile analyzing LEED (SPA-LEED) [1–10].
Energetics and/or kinetics in the system govern Si surface changes the surface reconstruction, and
the change of surface reconstruction causes a the surface morphology after step bunching [2,3].
In the present paper a REM study of Cu adsorp- change in surface free energy. When a foreign
metal is adsorbed on a Si vicinal surface, metal tion induced step bunching on a Si(111) vicinal
surface is presented. adsorption induces surface reconstruction on a low
index Si surface. The areas with the surface recon-
struction expand by further adsorption due to the
reduction of the surface energy of the reconstructed
2. Experimental procedure
areas, and step bunching occurs at the same time.
Thus, a surface with a regular array of steps
The experiments were performed using an ultra-
changes to a hill and valley structure. This may
high vacuum electron microscope ( UHV-EM )
equipped with a Cu evaporator and a thickness
* Corresponding author. Fax: +81-3-5734-2079.
monitor. Si samples with a size of 7×1×0.4 mm3
E-mail address: hminoda@surface.phys.titech.ac.jp
( H. Minoda) were cut from a (111) wafer 1.4° off towards the
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